Surface Mount PCB Assembly

High quality board assemblies begin with high quality stencil printers. If you don't have a good stencil print, it doesn't matter how good the rest of your SMT line is. Our top-of-the-line stencil printers, with automatic stencil cleaning and glue-dot capability, apply solder paste accurately by utilizing vision that aligns the board perfectly with the solder stencil. The unique prism-camera ensures quality soldering by looking at the board to inspect for solder presence and sufficient coverage of the pads, while at the same time inspecting the stencil to make sure all solder has been transferred to the board.

Our high-speed pick and place equipment incorporate advanced vision systems and are accurate within 25 microns (0.025mm). In addition, they can place a wide range of components; from 0201 chip components to 42mm-square components, and connectors up to 75mm long. Each of our 2 SMT lines include 2 pick and place machines, which gives us the ability to build extremely complex assemblies.

Our reflow ovens, with top and bottom convection heating and 8 heating zones/2 cooling zones, allow us to dial in complex temperature profiles to make sure your boards are soldered properly without being over-heated. Our wireless thermal profiler ensures that the oven profile is appropriate for your board assembly. If your product has BGA's and/or other bottom-terminated devices, we can confirm they are soldered properly with our x-ray equipment capable of oblique imaging.

Our operators have years of experience and are all trained to IPC-600 standards, as well as our internal procedures and checks which are all about "quality first".

ETEMCO has invested heavily on high quality surface-mount equipment. From our board handling conveyors, paste printers, placement machines, and ovens, we use highly accurate equipment to control our process.

Absolutely. ETEMCO can process PCBA’s of all complexities. We utilize x-ray inspection equipment to ensure the quality of bottom terminated devices, such as QFN’s and BGA’s.

ETEMCO utilizes x-ray inspection, 3D and 2D AOI equipment, as well as visual inspection techniques that are tailored to each individual assembly.

We are happy to work with your engineering team during the design phase of your PCBA. With our extensive experience we are often able to offer design recommendations that will make your product more manufacturable, saving you time and money during the assembly phase of your product.